Job Description

The Department of Electrical and Computer Engineering (ECE) at the National University of Singapore (NUS) is seeking a Research Fellow to support the development of a detachable fiber array unit (FAU) for co-packaged optics (CPO) systems. The role will focus on process and/or testing. Candidates will contribute to the design, fabrication, assembly, testing, and validation of flexible optical coupling structures and standardized optical interfaces for FAU integration in CPO systems. The work will be closely linked with simulation-driven design and optimization using tools such as ANSYS Multiphysics and/or COMSOL Multiphysics. This is an exciting opportunity to work at the forefront of semiconductor photonics and advanced optical packaging in close collaboration with industry partners and academic researchers

Responsibilities will involve:

1. Fabrication & Process Development
a)    Design the fabrication methods, process flow, and specifications. 
b)    Fabrication of the FAU with high V-groove pitch accuracy and uniform array flatness.
c)    Fabricate optical coupling configurations, including vertical and/or edge coupling. 
d)    Fabricate mechanically constrained FAU interfaces using precision-defined contactor-target geometries.
e)    Optimize low-expansion adhesive systems that preserve optical attachment.

2. Testing & Validation
a)    Design of characterization plans, test methodologies, and measurement setups relevant to the project objectives. 
b)    Validate FAU fiber-capacity performance by examining array pitch accuracy, fiber placement repeatability, and coupling uniformity.
c)    Characterize fabricated optical coupling samples by measuring beam profile, coupling efficiency, insertion loss, return loss, and misalignment tolerance.
d)    Perform mechanical characterization to study FAU alignment stability, including contact deformation, preload response, and positional repeatability during repeated engagement.
e)    Conduct thermal and reattachment-focused validation by examining drift over thermal cycles.
f)    Recommend process or design improvements based on characterization results to enhance performance and reliability.

3. Data Analysis & Reporting
a)    Manage the collection, preprocessing, and large-scale analysis of experimental and simulation datasets.
b)    Prepare technical reports, publications, and presentations for both academic and industry audiences.

4. Project Management & Collaboration
a)    Contribute to project planning, timelines, and milestones.
b)    Take responsibility for delivering research milestones within project timelines.
c)    Serve as the primary liaison with industry partners to align objectives and ensure impactful outcomes.

5. Innovation & Intellectual Property
a)    Contribute to patent filings, technology disclosures, and commercialization efforts.
b)    Publish findings in high-impact journals and present at leading conferences.

Qualifications

•    Ph.D. or equivalent degree in Electrical, Electronics, Mechanical, Chemical Engineering, Physics, Material Science or its equivalent from a reputable University/Institute is preferred, or equivalent related experience. 
•    Experience in clean room fabrication, dry etch, wet etch, optical interconnects, fiber arrays, photonic packaging, semiconductor packaging, microelectronics, characterization, metrology, or reliability testing would be an advantage.
•    Excellent communication skills and the ability to work effectively in a collaborative research environment.
•    Strong analytical, problem-solving, technical writing, and presentation skills.
•    Self-motivated, able to work independently, and collaborate within a diverse team.
•    Open to Fixed Term Contract.